真空腔體水氣解吸附組件
The ZCUVE represents the most recent advance intechnol water vapor desorption ogy. The unique design is scalable from 2.75” to 8” flange sizes with aproportionally higher UV power factor with larger flange sizes.
The ZCUVE was designed to desorb water from large deposition chamberswhere it is not practicable to have an exposed UV emitter inside the vacuumchamber. Standard off-the-shelf shutters can be used to prevent the ZCUVE frombeing coated during deposition processes.
This process works best on o-ring (Viton) sealed vacuum chambers that donot have any other way to bake out, and also for smaller sized load-locks.技術參數(shù)：
型號 | 法蘭口徑 |
Z275 | 2.75" / 40 CF |
Z450 | 4.5" / 63 CF |
Z600 | 6.0” / 100 CF |
Z800 | 8.0” / 160 CF |
An external assembly houses the UV emitter, which is situated just behind ahigh UV transmission, ultra-high vacuum window. A mirror on the back side ofthe emitter further improves the transmission of 185 nm UV radiation throughthe window and into the vacuum chamber. The ZCUVE housing is backfilled with aninert gas to prevent ozone production within the housing. Finally, the emitterleads are connected via MHV high voltage connectors to the control.
主要特點：
The advantage of using UVC radiation to desorb water vapor is that isproduces very little heat. Less heat means less damage to mechanicalparts and samples. Another advantage is that UVC does not require a direct lineof site in order to desorb
water vapor. It can’t get into nooksａnd crannies, but it can reflect off of polished surfaces (like chamber walls)with a loss of 50% to 70% per " bounce" .
UVB-100
The UVB-100 uses UVC radiation to desorb water vapor without heat. Theemitter extends into the vacuum chamber.
ZCUVE
The ZCUVE (Zero Clearance UV Emitter Water Vapor Desorption System) usesUVC radiation to desorb water vapor without heat. The emitter resides outsidethe vacuum chamber.
Note: These water vapor desorptionproducts are designed to work with high vacuum systems, large vacuum, chambers,ａnd load locks. They are not designed to replace radiant bake-out methods inultra-high vacuum systems, but are UHV compatible
